BGA type packaging memory substrate manufacture

Description Of IC Substrate pcb

BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality guarantee,It is also one of types of the semiconductor package substrate,for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the memory IC packaging, and the share of IC substrate.

Application:

• ​DDR
• MicroSD devices
• Flash memory devices
• Computer electronics,DDR
• Sd card / memory card

Spec.of pcb production:

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

FAQ:

1. Where's HOREXS company location ?

HOREXS group has two factories,Old factory located in huizhou city Guangdong,Another one is located in Hubei provice.

1. Does HOREXS have MOQ/ MOV ?

HOREXS no set any MOQ / MOV for any clients now.

1. Can HOREXS produce big volume ic substrate ?

Yes,We can,Our old factory capacity is 15000sqm/month,New factory is 50000sqm/Month.

1. What we should contact If we are seeking cooperation with HOREXS ?

Contact person:AKEN,email ID: akenzhang@horexspcb.com,Support roadmap/Design rules files,Production capability files.

1. Does HOREXS support IC package / IC design service ?

No,We dont have it,We are only semiconductor ic substrate manufacture,But we can let our clients to help.

1. What does HOREXS need when we need quotation ?

• Gerber files;
• Production specifications;
• If multilayer pcb substrate,Also need buildup/stackup information;
• Others good for quotation files;

1. Can HOREXS produce FCBGA package substrate now ?

No,From HOREXS roadmap ,HOREXS will start FCBGA substrate manufacture in 2024 or 2025.

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Shipping:

• DHL / UPS / Fedex;
• By air / By sea;
• Customize Express (Own account of DHL / UPS/ Fedex)

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BGA type packaging memory substrate manufacture Images